Panel Topic: Challenges and Emerging Techniques for Efficient M2M Data Transport over Wireless Mobile Networks
Moderator: Dilip Krishnaswamy - Qualcomm [Slides]
Machine-to-machine (M2M) applications across different verticals such as healthcare, smartgrid, automotive, tracking, and other areas, have many common characteristics. These characteristics relate to the priority of the data being communicated, the size of the data, the real-time streaming needs on one end of the spectrum to the extremely high delay tolerance of the data on the other end of the spectrum, and varying degrees of mobility. Mobile networks are characterized by varying capacity, bandwidth, link conditions, and link utilization, and overall network load, that affect their ability to reliably transfer such M2M data. This panel will discuss these varying needs across the M2M verticals along with the varying capabilities of mobile wireless networks. The panel will also discuss proposed changes in wireless networking standards, along with end-to-end middleware solutions to address these needs and capabilities.
Arlen Nipper - President & CTO, Cirrus Link Solutions [Slides]
- 33 years of direct experience in the embedded computer industry
- 10 years of Oil/Gas SCADA systems experience with Amoco and Koch Oil
- Cofounder of NovaTech as VP of Engineering
- President of Arcom Control Systems
- President and CTO of Eurotech Inc.
- Co-developed MQTT with IBM
- Board member of the HART Communications Foundation (6 years)
- Developed AT&T VSAT SCADA infrastructure (SNET)
- Executive presentations for IBM, Intel, Stanford University CTO Forum
- Helped establish the Eclipse Foundation M2M Industry Work Group
Arlen has 33 years of designing, manufacturing, and deploying M2M solutions in Oil/Gas, Gaming, Medical, and Sensor network market verticals. His unique perspective on the M2M market is combining the Operational requirements of tier 1 companies with the overall M2M fabric of existing devices, network topologies, and back office requirements for true device data integration.
Paul Congdon - HP Fellow, HP Labs [Slides]
Paul Congdon is an HP Fellow in the Networking and Communications Lab within HP Labs. He is responsible for researching future directions and technologies for mobility, wireless and network infrastructure. In his 26 years in the networking industry, he has become widely esteemed as an inventor and leader in driving networking industry standards.
Congdon has previously held positions at the CTO for HP’s ProCurve Networking Business, Vice Chairman of the IEEE 802.1 committee and Technical Advisor for the IETF RADIUS Extensions Working Group. His long-time activities with the IEEE 802 standards efforts involved him in the creation of the Ethernet LAN. He is co-inventor of the commonly used TCP checksum offloading, a program for accelerating the networking performance of TCP/IP within servers. He also architected the method of distributing HP Networking software onto multiple processors, enabling HP switch software to scale between low-cost, single-chip solutions and high-end, multi-modular chassis systems.
After completing internships with IBM, Congdon joined HP in 1985 as a Software Development Engineer responsible for the creation of networking protocols within HP-UX. He expanded his focus to network infrastructure architecture and has been involved in the design of a wide range of network devices and technologies, including routers, Layer 2/3/4 switches, iSCSI storage devices, SNA, X.25, FDDI, Ethernet, wireless LANs, virtual LANs, link aggregation, LLDP, Virtual Edge Port Aggregators (VEPA) and access security protocols, including IEEE 802.1X.
Congdon earned his Ph.D. in Computer Science at the University of California, Davis and his Bachelor of Science, magna cum laude, and Master of Science degrees from California State University, Chico. He currently holds 11 patents related to the networking industry and has several more in process.
Pete St. Pierre - Principal Member of Technical Staff, Oracle [Slides]
Mr. St. Pierre is a member of Oracle Labs' Sensor Platform research team and is the Technical Lead for Communications on the SPOT Project. The SPOTs have earned several industry accolades (e.g. from JavaLobby, InfoWorld, Make magazine) and more than twenty thousand of these devices are in use worldwide (search the keyword "spaughts" on YouTube or Flickr for a sampling of these projects). Oracle labs demonstrated a solution for real-time monitoring of shipping containers using this platform at Oracle Open World 2011. Mr. St. Pierre and his fellow SPOTs Project team members were among the 2009 recipients of the Sun Microsystems Chairman's Award for Innovation.
Mr. St. Pierre has 22 years of experience in Internet Protocol and network applications development. During this time, he has worked extensively with the IETF on the advancement of Internet standards in the area of network management, service discovery and transport protocols. Mr. St. Pierre is co-author of "SLP: Service Discovery for Enterprise Networks" and holds multiple patents in the area of networking and communication technology. Mr. St. Pierre is a founding board member of the IPSO Alliance, which was created to promote the use of the Internet Protocols on Smart Objects. He currently serves as President of the Board of Directors.
Tom O'Neill - Founder & CEO, Cluster Wireless [Slides]
Dr. Tom O'Neill is founder and CEO of Cluster Wireless, which develops M2M middleware. Cluster will commercially release its code for machine-to-machine middleware in July 2012, which promises to reduce costs and time to market, and potentially horizontal-lize the M2M ecosystem.
From 2002 to 2008, Tom was Vice President for Business Development for Qualcomm, with activities in Africa and Southern Asia. He originally began at Qualcomm in it fledging chipset division, QCT, in 1995, and became Vice President for integrated circuits development programs. Prior to joining Qualcomm, Dr. O'Neill was a Director at US WEST Advanced Technologies in Boulder, Colorado. And before US WEST, Tom was employed at several semiconductor processing companies.
Tom has a doctorate from MIT, and Master's and Bachelor's engineering degrees from UC Berkeley, and UC San Diego, respectively. He also holds an MBA from UCSD
Y.S. Rao - VP, Qualcomm [Slides]
Y.S. Rao is a Vice President (since 2003) at QUALCOMM Inc, San Diego, in Qualcomm Corporate Engineering (QCES) having joined in 1995. His current actvities relate to technical and engineering support to various (W)CDMA/LTE operators. He has over 30 years of experience in the wireless communication industry, which includes R&D, Product Management and Engineering. While at Qualcomm he had also taught several CDMA/UMTS/LTE courses in several countries.
In his early career, he also worked in as a lecturer, teaching graduate level courses in circuit theory, radio and satellite communications. He is a member of the IEEE, a Fellow of the IETE (India) and holds B.E (Hons) (EE), M.Tech (ECE) from the Indian Institute of Technology, New Delhi, India and a Ph.D degree (ECE) from JU, Calcutta. In addition, he has published more than 50 technical papers and edited a book on VSATs. He had been a frequent technical speaker and chaired technical sessions at various International Conferences.